Intel FAB38
BIM Leaders LTD BIM Leaders LTD
BIM Case Studies
February 5, 2025

Optimizing Semiconductor Facility Design with BIM: Insights from Intel FAB38

The semiconductor industry requires advanced facility design to support high-tech manufacturing processes essential for chip production. Due to the increasing complexity of semiconductor fabrication plants (FABs), companies such as Intel utilize Building Information Modeling (BIM) to optimize their facility designs.
The design of semiconductor fabrication plants, such as Intel FAB38, demands high precision, compliance with industry standards, and efficient construction process management. The use of BIM enables the achievement of these goals, and BIM Leaders LTD adheres to these norms and standards.


With cutting-edge 3D modeling techniques, strict compliance with ASME, Intel, and other industry standards, and a focus on improving project efficiency, BIM Leaders helps optimize the entire project lifecycle.
Credits: ‘Every Die Wants to Live’: Inside Fab 28, Intel’s Elite Chip-Making Site | PCMag Credits: ‘Every Die Wants to Live’: Inside Fab 28, Intel’s Elite Chip-Making Site | PCMag

What Does FAB Mean in the Context of Semiconductor Manufacturing?

FAB stands for Fabrication Plant, referring primarily to semiconductor manufacturing facilities.

A FAB is defined as: "An Intel FAB cleanroom is thousands of times cleaner than a standard hospital room." (This information is taken from the official Intel website. Intel)

Compliance with ASME and Intel Standards

One of the biggest challenges in designing semiconductor fabrication plants is ensuring strict adherence to safety and performance standards. BIM Leaders guarantees compliance with the following standards:
  • ASME (American Society of Mechanical Engineers) – Ensures the quality control of piping, mechanical systems, and ventilation to guarantee safe and efficient equipment operation
  • ASME B31.3 (Process Piping) – Regulates piping requirements for process systems, which is critical for transporting chemicals in semiconductor manufacturing.
  • ASME BPE (Bioprocessing Equipment) – Standards applied to ultrapure piping systems used in manufacturing, particularly in FAB cleanrooms.
  • Intel Standards – Compliance with the company’s internal material selection requirements to maintain high manufacturing quality
  • IPD (Intel Project Design) – A set of internal Intel regulations defining project design requirements for safety, material selection, and equipment durability.
  • Material Selection Standards – Intel imposes strict material selection requirements for piping, ventilation, and other systems to prevent particle emissions that could affect chip quality.

Compliance with Israeli Construction and Environmental Standards

  • SI (Standards Institution of Israel) – National Construction Standards
Ensures compliance with building, environmental, and safety regulations in Israel:
  • SI 5281 – Green Building Standards. Defines energy efficiency and environmental requirements for buildings. Focuses on emission reduction, efficient resource consumption, and sustainable material use.
  • Environmental Standards & Emission Control. Israeli Environmental Protection Law requires strict control over hazardous air emissions and toxic waste disposal. FAB plants must minimize environmental impact using advanced filtration and air purification systems.
  • Automated Standards Verification BIM-based monitoring ensures compliance with regulations and reduces the risk of errors at early design stages.

3D Modeling in the Intel FAB38 Project

BIM Leaders actively implements cutting-edge 3D technologies to enhance all stages of the Intel FAB38 project:
  • Cloud Collaboration with Clients and colleagues from other departments based on platforms such as BIM360 and Procore enable real-time collaboration among distributed teams, ensuring seamless communication and project efficiency.
  • Coordination workflows and collaboration solutions in BIM Track platform that gives you the power to communicate across platforms on the issues that matter.
  • Digital Twins, which create exact digital copies of an object, allow you to test and optimize the design before construction begins. Augmented Reality (AR) and real-time modeling are now part of BIM. In the project we use software from Israeli startup BUILDOTS, which uses artificial intelligence (AI) and BIM to optimize construction processes.
  • Integrated 3D modeling, which combines architectural, mechanical, electrical, and plumbing systems into a single information model, preventing design conflicts.
  • The Internet of Things (IoT), which allows you to monitor the condition of pipelines and components throughout their entire life cycle.

Conclusion

BIM Leaders ensures full compliance with design and construction standards for semiconductor fabrication plants, which is critical in the high-tech industry. By implementing BIM technology and automated quality control, BIM Leaders guarantees:
  • Compliance with international ASME standards for the safe and efficient operation of mechanical systems, piping, and ventilation.
  • Adherence to Intel’s internal requirements for material selection, engineering system design, and cleanroom organization.
  • Fulfillment of Israeli construction and environmental standards, ensuring seismic resistance, efficient water supply, and minimized environmental impact.
  • Process optimization through 3D modeling, digital twins, and automated standards verification.
This approach not only prevents errors at the construction stage but also reduces costs, accelerates project execution, and ensures stable manufacturing operations in the future.

BIM Leaders LTD – your trusted partner in designing cutting-edge, high-tech facilities worldwide!

BIM Leaders LTD Let’s build smarter together!
If you’re looking to enhance your construction processes and reduce waste with BIM, get in touch with us today.

📧 Email: info@bim-ae.com
🌍 Website: bim-ae.com
📞 Phone (Israel): +972 52 490 5100
Join us in shaping the future of sustainable construction!
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The semiconductor industry requires advanced facility design to support high-tech manufacturing processes essential for chip production. Due to the increasing complexity of semiconductor fabrication plants (FABs), companies such as Intel utilize Building Information Modeling (BIM) to optimize their facility designs.

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